LAGUNA HILLS, Calif.--(BUSINESS WIRE)--BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, brain-inspired ...

SonicEdge will be showcasing its next-generation integrated solutions, including the SonicTwin 100, to invited customers, ...

BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...

The Ministry of Science and Technology has announced the establishment of the National Center for Supporting Semiconductor ...

The big picture: The semiconductor industry is approaching a significant milestone as TSMC prepares to expand the physical scale of its chip packaging technology. At its recent North American ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

TL;DR: SK hynix unveiled a 30-year DRAM roadmap featuring 4F2 Vertical Gate and 3D DRAM technologies to enhance performance, integration, and power efficiency beyond 10nm scales. These innovations aim ...

Nvidia has announced a US$20 billion deal to acquire non-exclusive technology licenses from AI chip startup Groq, with Groq's current CEO and core research and development team joining Nvidia to work ...

Scientists have developed a groundbreaking on-chip quantum memory platform using 3D-nanoprinted hollow-core waveguides called ...