Many applications require joining metals to ceramics, such as sealing electrodes to glass enclosures for light bulbs. Such joints need to provide continuous chemical contact across the interface ...
Copper-plated ceramic addresses the interconnection requirements of many of the latest electronics systems. The key features stem from the combination of the insulator, the conductor and the ...
Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...
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