Understand how IC substrates adapt to durability signal and sustainability demands faced by manufacturers and users of modern smart cards.

The measurement of film thickness holds significance for various manufacturing and research facilities. Fluctuations in the thickness of paint or coating can impact multiple properties crucial to the ...

More than ten years ago, researchers at Rice University led by materials scientist Boris Yakobson predicted that boron atoms would cling too tightly to copper to form borophene, a flexible, metallic ...

Surface preparation methods, such as degreasing alone or degreasing followed by abrasion and removal of loose particles, are generally adequate for most adhesive bonding applications. However, to ...

Researchers from the U.S. Department of Energy's (DOE) Brookhaven National Laboratory and DOE's Pacific Northwest National Laboratory (PNNL) have uncovered an unexpected interface layer that may be ...

That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s ...

Mussels, barnacles, and other sticky marine invertebrates have been many a researcher’s inspiration for designing novel adhesives. A new study shows for the first time that the proteins in the natural ...

LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart ...

Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...