Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Microsemi Corporation introduced the industry's smallest hermetic surface mount package for power transistors and diodes. Microsemi pioneered the development of the new industry-standard U4 package, ...

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

For a number of years now we have seen leadless DFN packages (discrete, flat, no-leads) for discrete components which, compared to conventional SMD packages, do away with contact and assembly ...

It’ll come as no surprise to any savvy buyer, and certainly not to any design engineer, that each new generation of electronic products packs more performance into a smaller package than the product ...

GOLETA, Calif.--(BUSINESS WIRE)--Transphorm, Inc. (Nasdaq: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today announced ...

Surface Design Solutions, a leader in next-generation manufacturing software, announced it has secured $365,000 in funding from the Richard King Mellon Foundation to support the next generation of ...