Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...

There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...

Today’s complex SoCs are prone to thermal issues that can cause field failures. Here’s how thermal analysis can help you ferret out those hotspots. As the semiconductor industry traverses through the ...

The level of difficulty in designing electro-technique devices has increased, owing to thermal stress. With the development of electric vehicles and electric aircraft, and to keep up with the recent ...