Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration
Warpage Characterization of the Direct Bonded Copper (DBC) for 3…
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2.2K views · 45 reactions | After copper and other conductive metals are deposited onto a wafer, a redistribution layer (RDL) re-routes conductive bumps to more desirable positions, enabling higher contact density and subsequent packaging steps. RDL is a key application in our SABRE® 3D product family — learn more. https://bit.ly/46T6old | Lam Research Corporation | Facebook
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